Other Parts Discussed in Thread: TPS659037, DRA752, TPD12S015, TMP102, TLV320AIC3104, TPS22920, BEAGLEBOARD-X15
We have an existing custom AM5728 board design which has been working fine for years now, with firmware based on SDK 02.01.00.07.
Updating to SDK 06.01.00.08 as a base, upon boot to the new firmware the chip die temperature rises rapidly and we get themal shutdown when it reaches >90C. The chip appears to have been damaged since rebooting with the older firmware afterwards then produces the same behavior. During this time we can observe no significant loading on the CPU or other subsystems; with the older firmware, we never got overtemp happening even under heavy load.
Looking at the forums there is apparently a similar overtemp issue that can arise if the power sequencing is violated - but how could this be related to the new SDK?
The condition has been verified on 2 boards, and since the chip gets damaged, I'm reluctant to burn up any more.
What are the potential SDK-related factors which could cause this issue, and how can it be addressed? Is the PMIC programming somehow different with the new SDK environment?
Obviously this is a blocking issue for us. Thanks in advance for any help.
---Chris