TDA2EG-17: Packaging and Thermal questions

Amelie Zheng

Part Number: TDA2EG-17

Hi Team,

My customer now use TDA2EGBHQCBDRQ1 and have two questions may need your kindly help.

• Packaging related: What is the minimum chip height of TDA2EGBHQCBDRQ1? Only the maximum is 1.298

• Thermal performance related: Is there any data on individual chip heating differences? Is there a thermal resistance parameter in the case of 6W?

over 6 years ago

0 Amelie Zheng over 6 years ago

TI__Genius 10865 points

pls use the weekly meeting to highlight the processor issue.
And we have been hacing the task force ongoing for weeks, they worked w/ Peter on daily base.

0 kcastille over 6 years ago in reply to Amelie Zheng

TI__Guru 57737 points

Amelie,

Sorry for the delay. The package minimum height is 1.168 mm.

Yes, there is device to device variation in power consumption. When TI provides a power estimate it is for a worst case unit.

The thermal resistance characteristics don't change significantly from 3W to 6W.

Regards,

Kyle

Processors

Processors forum

TDA2EG-17: Packaging and Thermal questions