DM365 Heat Sink

Mahdi Olfat

Prodigy 60 points

Hello,

Our design includes DM365 and DM6435 chips (BGA packages).

We would really like to use heat sinks for the chips and would like to secure strongly.

Does TI recommend heat sinks for its chips (anything at all)?

Thanks,

Mahdi

over 14 years ago

0 Marcus Cooksey over 14 years ago

TI__Genius 9510 points

There are quite a few factors to consider when selecting a heat sink, which would differ based on overall application/solution, board layout (how close the components on the board are as well as air flow). Therefore, a specific recommendation as to which particular heat sink you should use for either DM365 and DM6435 can't be definitive.

Please however review the application notes for heat sink attach methods and vendor list at http://www.ti.com/litv/pdf/spraal9

Also refer to the power consumption calcuation sheet to help determine the estimated power consumption for you particualar application as it relates to the DM365 (similar should be available for the DM6435) http://focus.ti.com/dsp/docs/litabsmultiplefilelist.tsp?sectionId=3&tabId=409&literatureNumber=sprab68&docCategoryId=1&familyId=1446

Processors

Processors forum

DM365 Heat Sink