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TMS320C6657: Thermal Characteristics needed for thermal simulation for soldering

Darren (FAE)
Expert 5483 points
Part Number: TMS320C6657


My customer is reaching out for thermal characterization data related to the package/pins of the TMS320C6657CZHA25. 

They are asking for the following information (both package and pins)

- Specific Heat
- Density
- Thermal Conductivity

I believe the goal is to understand things such as thermal expansion, etc during soldering, and use this information to increase reliability during soldering.

There are two app notes I have found:

SPRABI3B
SPRA953C

Is it possible to infer the necessary information from these calculations, and the thermal metrics in the DS...?

Example:

Just below Table 3 from the SPRA953C App Note, there is information such as "Die Attach Impedance" and "Mold Compound Thermal Conductivity"...is this information available somewhere? (If internal, you can send me a message  offline)

Otherwise, if you could provide me with the above 3 thermal metrics for package/LeadFrame(pins) I can share with the customer, that would be hugely appreciated.

Regards,

Darren

  • 0
    TI__Mastermind 46460 points

    Darren,

    Those application reports are explaining thermal calculations related to heat dissipation.  That is for system functional analysis, not for reflow.  The standardized information needed is in the MSL rating and reflow guidance.  This is shown on the webpage at www.ti.com/.../TMS320C6657 under the "MSL rating / Peak reflow" heading.  This same information is printed on the package labels when parts are purchased.  This is a JEDEC industry standard classification.  The value for this device is "Level-3-245C-168 HR".  The information requested is not provided as you would need this for every element of the package and that is outside of our support scope.

    Tom