Nitheesh

There are some thermal considerations for AM335x that are maybe of value to you.

https://processors.wiki.ti.com/index.php/AM335x_Thermal_Considerations

In addition you can find the existing simulation models under the Design & development section in the link below

https://www.ti.com/product/AM3359#design-development##design-tools-simulation

Please let me know if this information does not satisfy your request.

Regards,

Thomas Krause

Hi Thomas,

I am planning to model the package in detail and run the simulation. The dimension details available in datasheet is only outer dimension. 

It would be great if you could provide the internal structure(like die size, die thickness, substrate thickness , vias etc)  that would help in modelling the package in detail.

Or

 Can you provide the thermal model in .tzr or .pdml format?

Thanks & Regards,

Nitheesh

Hi Thomas,

Can provide the thermal model in .tzr or .pdml format?

Nitheesh

Currently we do not have this model available and we are looking at the feasibility to generate this thermal model.

I will get back to you within one week.

Regards,

Thomas