Hi
I am a Technical Sales Engineer from Arrow Korea.
My customer found about 200 failure devices of AMIC110 upon SMT assmbled or during full-load test these week.
Hence they asked us to request TI Failure Analysis Process wo detail descriptions or photo. so I am asking to prepare the initial basic report for TI to understand issue following up TI's Return Process Guidance.
BTW. I would like to double check with customer about SMT and Their Test Scenario.
Could you please let me share TI's PCB SMT or Assembling Guidance if applicable? i.e. The document describe the detailed temperature condition for Soldering, Humidity/Temperature for Keeping storage, Heatsink /Hear Release and so on.
If available, website link or pdf document which is specific for AMIC110 would be preferred.
Thanks.
Best Regards,
Jack Cha
