AM6442: Package balls not modeled in the thermal model

Francois Charlot

Part Number: AM6442

Hello,

My customer wants to run thermal simulations with our AM6442 FloTHERM model (pdml file). But he saw that the package balls were not modeled, and he thinks that this would affect greatly how the heat transfer to the PCB is simulated. How would you advise to proceed? Thank you.

Best regards,
François.

over 4 years ago

0 Shriram Moharil over 4 years ago

TI__Expert 4490 points

Hi Francois,

Let me check on the correct answer for this and get back to you. In general we have always supported FloTherm models for SoC designs due to their smaller size and simplicity as compared to Delphi models.

regards,

-Shriram

0 Shriram Moharil over 4 years ago in reply to Shriram Moharil

TI__Expert 4490 points

The FloTherm model did include the balls. These were modeled as a single block with orthotropic thermal conductivity. It only conducts in the through plane direction but will include the BGAs. Individual BGAs are not modeled in a compact thermal model such as this one.

regards,

-Shriram

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AM6442: Package balls not modeled in the thermal model