Hi,
My customer wants to know solder ball details at package side (not PCB/board side).
Please see below picture.
Q1) Which pad type (SMD or nonSMD) is used?
Q2) What is pad diameter size (A)?
Q3) What is solder resist opening size (B) ?
Customer knows similar information for PCB/board side is available in datasheet mechanical data section, but they want to know device side as well.
Thanks and regards,
Koichiro Tashiro