Hi Board designers,
Information related to S-parameter models. is provided in the IBIS model and should be used for simulations.
Refer Below:
This information is provided in the IBIS and should be used for simulations.
Package model is defined on line 88 here in IBIS:
[Package Model] am62_pkg
|
[Pin] Signal_name model_name
F6 ATEST0 NC
AE2 ATEST1 NC
And the definition is on line 168264 here in IBIS:
| Package Model
|
|************************************************************************
|
[Define Package Model] am62_pkg
[Manufacturer] name 1
[OEM] name 2
[Description] 329-pin Package
To use these, they have to ensure they check the “Package Parasitics” in the Ctrl IBIS block of the simulation
This is what it looks like in the simulator we use
IBIS has two package model sections
Pin RLC – references R_pkg, L_pkg, C_pkg from Package
The “Pin RLC” is simply a summary matrix of min/max/typ values across all pins.
Package Model – references am62p_pkg from bottom of IBIS (different per pin)
The Package Model which contains fully coupled L/C information on a per-pin basis is the accurate one.
Package RLC should provide a pretty good estimate as they contain fully coupled data.
This will be update in the DDR design guide
Additional reference
Note: The description shown above is for AM625. Use IBIS model to find the information based of the selected device.
Regards,
Sreenivasa
