This thread has been locked.

If you have a related question, please click the "Ask a related question" button in the top right corner. The newly created question will be automatically linked to this question.

TMP117: Underfill usage for stress mitigation

Part Number: TMP117

Hello,

I had the same question as was asked in the previous thread but resolved elsewhere, regarding mitigating mechanical stresses on this part without soldering the thermal pad.

Thank you,

Thomas