TMP117: Using underfill for mechanical stress mitigation on WLCSP package

Hello, 

I was wondering if there was any guidance for how to use underfill for the TMP117 WLCSP part. My main concern pertains to this specific part because in the TMP117 datasheet, it says mechanical stress can be a source of additional measurement error. (page 36) www.ti.com/.../tmp117.pdf

We would like to use underfill as a method of protecting the part from shock/vibration, not so much for thermal stresses mitigation. However underfill can apply mechanical stresses during curing and we wanted to know if there was a specific type that will work best with this part? Are there other suggested ways to mitigate this part from breaking off a PCB during physical stress? Also, how sensitive is this part to mechanical stresses?

Thanks,

Suril