TMP1075: DSG Package exposed pad electrical connection

Keshav Raj

Part Number: TMP1075

Hello,

According to other answers and design guidelines, the exposed pad of the sensor can be connected to GND or left floating.

I was wondering if there is any electrical connection to the pad, and whether I can connect this pad to planes of voltages other than GND. (<100V)

The intended purpose is to monitor the temperature of a FET and whether I can connect the exposed pad to the copper plane the drain of the FET is connected to.

Thanks,

over 2 years ago

+1 Eddie LaCost over 2 years ago

TI__Mastermind 44030 points

Hello,

Please see the thread below. In short, the thermal pad is not connected internally, but does not include isolation, so the pad must be limited to the absolute max of 6.5V.

https://e2e.ti.com/support/sensors-group/sensors/f/sensors-forum/1073657/tmp1075-wson-exposed-pad-voltages

0 Gordon Varney over 2 years ago in reply to Eddie LaCost

TI__Genius 9380 points

also from a similar question about isolation:

The die silicon oxide is sitting directly on top of the thermal pad. This provides the best thermal sensitivity and thermal conductance possible. The die is not connected electrically to the thermal pad. However: There is no isolation barrier between the thermal pad and the die. No testing was performed for an isolation breakdown voltage. The data sheet does not reflect any information about floating the thermal pad above MAX VDD. That means that the thermal pad is subject to the same restrictions as the die itself. The thermal pad would be restricted to MAX 6VDC as is the rest of the silicon from TI's point of view.

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TMP1075: DSG Package exposed pad electrical connection