TMP102: Chip screen printing

Based on the information in the following E2E post, TI expects these devices to solder correctly if the solder guidelines are followed. https://e2e.ti.com/support/sensors-group/sensors/f/sensors-forum/1068774/soldering-defect-in-tmp112aidrlr

This device is specified for MSL Level 1 260C, which means it should have 260C peak reflow temperature, and unlimited floor life at 30C. Exposure to moisture and high temperatures may shorten floor life as described in the following app note. https://www.ti.com/lit/spraby1

thanks,

ren

您好，想和您确认的问题主要是如下问题：
引脚上下表面颜色不同，芯片引脚上表面是黑色的，下表面是银色的。

想确认下本次供货的产品 上下表面颜色不同是什么原因?涂层不同导致，或氧化等其他问题导致。

Hello, I would like to confirm with you the following questions:
The upper and lower surfaces of the pin are different colors, the upper surface of the chip pin is black, and the lower surface is silver.

I would like to confirm why the upper and lower surfaces of the products supplied this time have different colors? Different coatings, or other problems such as oxidation.

Could you please share the the actual lot numbers or photographs of the package labels?

thanks,

ren

please check the the actual lot numbers or photographs of the package labels.

Look forward to your reply

thanks

With the images shown, i dont see any concerns. Is there a problem with reflowing these devices in the final assembly or an electrical issue? Or is the customer just worried with the visual differences?