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HDC2010: Functional Failures HDC2010YPAR

Luis Luna1
Prodigy 30 points
Part Number: HDC2010
Other Parts Discussed in Thread: HDC2080

Currently we are facing problems with a product where we are using the PN HDC2010YPAR. The sensor is providing measurements out of the specification, at least for 10 points. We removed one sensor from a failed unit by a new directly form the reel and then passed the functional test. We validate profile in STM, soldering joints on components and check components that are connected to the sensor and not any abnormality there. I can confirm that not exposure to any kind of chemicals, proper packing conditions. Can you share with me a clue of what could be happening?  Any advice from your side?

Thanks in advance

  • 0
    TI__Guru* 91206 points

    Dear Luis -
    Are you also by chance also see and follow section 10.1.1.2 in the datasheet? Page 30 ==> 

    http://www.ti.com/lit/ds/symlink/hdc2010.pdf

    last two sentences read: 

    ...After reflow, it is expected that the sensor will generally output a shift in relative humidity, which will reduce over time as the sensor is exposed to typical indoor ambient conditions. These conditions include 30-40% RH at room temperature during a duration of several days. Following this re-hydration procedure allows the polymer to correctly settle after reflow and return to the calibrated RH accuracy.

    Can you check that out on your side? 

  • 0 in reply to Josh Wyatt
    Prodigy 30 points

    Thanks for you reply. In order to assure the porper re-hydratation is necessary a special equipment / oven / etc?

    Is enought if product is keeped to normal enviroment on the production area (aasuring that RH is in the range of 30-40%)?

    Do you thnis that if sensor is touched direclthy with a finger / hand it could damage the component?

  • 0 in reply to Luis Luna1
    TI__Guru* 91206 points

    Dear Luis - 

    The HDC2010 sensor is on the bottom of the package. Anything that gets in there or obstructs air flow will have an effect on the sensor.

    Regarding touching it - in a clean environment, with ESD protections in place, this could be OK.

    It is recommended to put the sensors in the 30% to 40% at room temp environment - would recommend it be a clean and ESD protected one, too.  

  • 0 in reply to Josh Wyatt
    Prodigy 30 points

    I understand handling and we use EDS protection, When you say clean environment, is there any special requirement for this? clean room is required?

    When you say sensor is in the bottom of the package it means that is located in the same side than the balls array (under the component).

    We need to assure not obstructions of any type under the component, is it correct?

    Colud be possible that component fails if during testing, tester by it self in some way is covering this area of the component?

    Thanks

  • 0 in reply to Luis Luna1
    TI__Guru* 91206 points

    Dear Luis - 

    yes the sensor is on the bottom of the IC, with a cavity - like this

    so - it does need to be protected and allow air flow

    Please see section 2 here http://www.ti.com/lit/an/snaa297a/snaa297a.pdf and on about how to optimize placement of the device, based on where the cavity is located. (HDC2010 vs HDC2080)