AWR1642: Vias on the board

Basel Tahboub

Part Number: AWR1642

I am wondering if all the Vias in AWR1642boost are capped or not, it's mentioned in the design files that not all the vias capped (figure 1), but (figure 2) shows that all the Vias is capped "if I am right"

And also I can't find the "via fill document", can anyone help me with that

Thanks

Basel

over 5 years ago

0 aozer over 5 years ago

TI__Mastermind 31115 points

Hello Basel,

All of the vias on the board are tented with soldermask as shown in your second image except for the via in pads under the BGA pads of the device. The vias under the BGA pads are capped with copper plating to prevent any issues with soldering the via on pad.

Regards,

Adrian

0 Basel Tahboub over 5 years ago in reply to aozer

Intellectual 295 points

Hi Adrian

Thanks a lot for the support,

Another question is there any plugged vias?

And can you tell me where can I find the "via fill document"?

0 Basel Tahboub over 5 years ago in reply to Basel Tahboub

Intellectual 295 points

Is there any updates?

0 aozer over 5 years ago in reply to Basel Tahboub

TI__Mastermind 31115 points

Hello Basel,

Other than the filled vias under the BGA and under any thermal pads, there are no plugged vias. Attached is the via fill document for 1843, I can't find the document for 1642 but they are virtually identical. Only the vias under the BGA or under a thermal pad are filled for all mmWave EVMS.

Regards,

AdrianVia_Filling_Requirements.docx

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AWR1642: Vias on the board