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Original question:

CD4051B: About datasheet revision changes from SCHS047K to SCHS047L.

CD4051B: CD4051B: About datasheet revision changes from SCHS047K to SCHS047L.

Hiroaki Yuyama TED
Expert 1720 points
Part Number: CD4051B

Tool/software:

Dear, Support Team.

There was a question on the PCN that we, the distributor, notified the customer.
This is a continuation of a thread I posted with the same title 3 months ago.

Based on the contents of the PCN, it would be difficult to clearly disclose the changes in the DIE (thickness, process, etc.) for the 300mm wafer.
What are the specific reasons that actually affected the ESD rating in the DIE changes?
This is a follow-up question asked by a customer.

Best Regards,
Hiroaki Yuyama
  • 0
    TI__Intellectual 1166 points

    Hi Yuyama-san,

    This update was part of our 300mm transition to a new fabrication. We attempt to meet the full datasheet spec when transitioning the die to 300mm for better long term supply. If a spec needs to be changed, the team strongly analyzes the proposed change across all target end equipment use cases to be sure it has as little effect as possible to the end system. If a line item is decided that it needs to be changed, as part of the outcome of the analysis, it is questioned and processed through the TI CMS council requiring a variety of sign off approvals. 

    Please let me know if this helps answer your question. I can't disclose details on the die architecture as this is a public forum

    Thanks,

    Stephen  

  • 0 in reply to Stephen Scheramic
    Expert 1720 points

    Hello Stephen-san,

    Thank you for your reply.
    As a distributor, I understand that manufacturers cannot disclose details of their manufacturing process.
    We will convince the end customer.

    Best Regards,
    Hiroaki Yuyama