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Original question:

CC1352P7: Need clarity on Reference Design for CC1352P7 at +20 dBM

CC1352P7: Discrepancy in Reference Design Documents

Gajendra Singh Sisodia
Prodigy 80 points
Part Number: CC1352P7
Other Parts Discussed in Thread: CC1352P

Hello Folks,

I have narrowed down CC1352P7 MCU for BLE Central application as this module also have integrated PA for better Range at +20dBm.

One might ask why stick to only CC1352P7 ? The reason being that's the only MCU which is available in TI.com's Inventory right now.

While going through the Reference designs available for CC1352P series MCUs I observed.

  1. Reference Design for LP-CC1352P7-4 Launchpad has CC1352P7 and RF circuitry which can output only +10dBm Output and that too for TX only (Ref. - Image A)
    1. What changes are to be done in the schematic to use CC1352P7 at +20 dBm for BLE instead of +10dBm ? The BOM changes are given for 20 dBm but the table doesn't match with the Schematic. (Image & BOM attached)  MCU077A-LP-CC1352P7-4 -RevA_BOM.xlsx
    2. Also, the Documents available for LP-CC1352P7-4 have lot of discrepancy between the Schematic and the BOM (Image attached above). The designator and values are not matching for most of the passive components.
  2. Reference Design for LAUNCHXL-CC1352P-2  has CC1352P1F3RGZ  and RF circuitry which can output +20 dBm Output
    1. Can the RF Circuitry of +20 dBm output be used with CC1352P7 ?
    2. I also compared the +20dBm circuitory in LAUNCHXL-CC1352P-2 & LP-CC1352P7-4 (PA Table) the values doesn't match for both of the schematics.

To sum it up the PA Optimization table (provided in Schematic), Schematic & BOM for the  LP-CC1352P7-4 doesn't match with each other at all, which creates a confusion as which of them should be followed to achieve +20dBm output. 

I request TI Team to please help me with the correct documents for LP-CC1352P7-4 so that I can proceed ahead with the design for the custom board for +20dBm, since we have product launch in December and discrepancy in documents have already wasted lot of critical time left for us.

  • 0
    TI__Guru**** 171104 points

    Hi,

    The LP-CC1352P7-4 comes assembled from the factory with the components that are optimized for the 2.4GHz 10dBm Tx power.

    The table you highlighted also contains the component values optimized for 2.4GHz 20dBm Tx power, but you need to remove the pre-assembled components for 10dBm and assemble the new ones suitable for 20dBm.

    Hope this helps,

    Rafael

  • 0 in reply to desouza
    Prodigy 80 points

    Hey Rafael

    Thank-you for the inputs.
    I understand that i need to remove the pre-assembled components and assemble the ones mentioned in Table for +20 dBm operation.

    There is one more thing on which I wanted your inputs, I noticed majority of passive components are 0201 size. As I am making custom PCB for CC1352P7 will it be okay to to use 0402 instead of 0201 size components for the RF Traces ?

  • 0 in reply to Gajendra Singh Sisodia
    TI__Guru**** 171104 points

    Hi,

    I am afraid there will be changes to the matching values due to the different sizes. The main reason is that the parasitic inductances and capacitances of the larger parts and their pads will cause variations that can negatively influence the performance. Would they be enough to cause your system to cease working? Probably not, but you will have a different performance figures such as Tx power, Rx sensitivity and potentially a larger power consumption.

    To perform a re-match of the design it is necessary to have experience in RF design and have access to test equipment and chambers, which can be done in-house or through a third party consultant.

    Best regards,

    Rafael