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Hello Folks,
I have narrowed down CC1352P7 MCU for BLE Central application as this module also have integrated PA for better Range at +20dBm.
One might ask why stick to only CC1352P7 ? The reason being that's the only MCU which is available in TI.com's Inventory right now.
While going through the Reference designs available for CC1352P series MCUs I observed.
To sum it up the PA Optimization table (provided in Schematic), Schematic & BOM for the LP-CC1352P7-4 doesn't match with each other at all, which creates a confusion as which of them should be followed to achieve +20dBm output.
I request TI Team to please help me with the correct documents for LP-CC1352P7-4 so that I can proceed ahead with the design for the custom board for +20dBm, since we have product launch in December and discrepancy in documents have already wasted lot of critical time left for us.
Hi,
The LP-CC1352P7-4 comes assembled from the factory with the components that are optimized for the 2.4GHz 10dBm Tx power.
The table you highlighted also contains the component values optimized for 2.4GHz 20dBm Tx power, but you need to remove the pre-assembled components for 10dBm and assemble the new ones suitable for 20dBm.
Hope this helps,
Rafael
Hey Rafael desouza
Thank-you for the inputs.
I understand that i need to remove the pre-assembled components and assemble the ones mentioned in Table for +20 dBm operation.
There is one more thing on which I wanted your inputs, I noticed majority of passive components are 0201 size. As I am making custom PCB for CC1352P7 will it be okay to to use 0402 instead of 0201 size components for the RF Traces ?
Hi,
I am afraid there will be changes to the matching values due to the different sizes. The main reason is that the parasitic inductances and capacitances of the larger parts and their pads will cause variations that can negatively influence the performance. Would they be enough to cause your system to cease working? Probably not, but you will have a different performance figures such as Tx power, Rx sensitivity and potentially a larger power consumption.
To perform a re-match of the design it is necessary to have experience in RF design and have access to test equipment and chambers, which can be done in-house or through a third party consultant.
Best regards,
Rafael