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CC2651R3SIPA: Bluetooth SIG

Ryuji Abe
Prodigy 20 points
Part Number: CC2651R3SIPA

Tool/software:

We are aware that this IC has been certified by Bluetooth SIG.
If the pattern and board thickness recommended in Guideline 10.4.2 are not followed, do we have to re-certify the Bluetooth SIG for a new product incorporating this IC?
Or, is a new Bluetooth SIG certification not required for products incorporating this IC even if the recommended conditions are not followed?

  • 0
    Prodigy 20 points

    Is it necessary to be certified not only by Bluetooth SIG but also by FCC, IC/ISED, ETSI/CE, RER (UK), Korea and MIC (Japan) in the same way?

  • +1 in reply to Ryuji Abe
    TI__Mastermind 20840 points

    Hi,

    Recertification for Bluetooth SIG is not required.

    However, depending on the amount of deviation in the layout from the reference design, there is a risk of not meeting FCC,ETSI etc. requirements.

    In which case the final design should be validated and tested for conformity.

    regards

  • 0 in reply to FI
    Prodigy 20 points

    Thank you for your reply.
    I understand that if the design doesn't follow Guideline 10.4.2, there's a risk of not meeting FCC and other regulatory requirements.
    Would this risk also apply to designs that follow Guideline 10.4.4?

  • +1 in reply to Ryuji Abe
    TI__Mastermind 20840 points

    Hi,

    Guideline 10.4.4 provides a path to mitigated risk if 10.4.2 is not met.

    You may have to do a radiated test to confirm performance.

    Although, since the module is only 5dBm capable, I do not foresee a great risk unless the deviation of final design is too much from recommendations in the datasheet.

    regards,