This thread has been locked.
If you have a related question, please click the "Ask a related question" button in the top right corner. The newly created question will be automatically linked to this question.
Tool/software:
We are aware that this IC has been certified by Bluetooth SIG.
If the pattern and board thickness recommended in Guideline 10.4.2 are not followed, do we have to re-certify the Bluetooth SIG for a new product incorporating this IC?
Or, is a new Bluetooth SIG certification not required for products incorporating this IC even if the recommended conditions are not followed?
Hi,
Recertification for Bluetooth SIG is not required.
However, depending on the amount of deviation in the layout from the reference design, there is a risk of not meeting FCC,ETSI etc. requirements.
In which case the final design should be validated and tested for conformity.
regards
Hi,
Guideline 10.4.4 provides a path to mitigated risk if 10.4.2 is not met.
You may have to do a radiated test to confirm performance.
Although, since the module is only 5dBm capable, I do not foresee a great risk unless the deviation of final design is too much from recommendations in the datasheet.
regards,