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CC2340R5-Q1: CC2340R5-Q1

cai cai
Prodigy 30 points

Part Number: CC2340R5-Q1

Hello, during our use of the TI Bluetooth chip (model: CC2340R52E0WRHBR01), we encountered a wake-up failure issue with the Bluetooth temperature sensor. After analysis and troubleshooting, we found that this failure is caused by the reset phenomenon of the sensor — the reset forces the sensor to stay in a continuous data transmission state. This constant data transmission leads to continuous power consumption, and eventually, the sensor cannot wake up once the power is drained.
We also investigated the root cause of the reset phenomenon and finally confirmed that it is induced by MCU abnormality. Relevant materials are attached for reference: Attachment 2attachment 2.pdf  includes partial investigation reports, and Attachment 1attachment 1.pdf  is the schematic diagram of the Bluetooth module. Please help analyze and troubleshoot this MCU abnormality. Thank you!

  • 0
    TI__Genius 9775 points

    Hello, 

    Thank you for the question. To clarify, you are using the Temperature Driver found in Temperature.h? Additionally, attachment 2 cannot be opened. 

    Can you provide more information on your implementation of the temperature module? Are you calling any resets within your firmware? 

    Let me know. 

    Thanks,
    Isaac

  • 0 in reply to Isaac Larson
    Prodigy 30 points
    The response to the MCU reset issue is as follows:
    1. Our application does not use the on-chip temperature sensor module.
    2. A watchdog is used in the software, but the possibility of the reset being caused by the watchdog has been ruled out.
    3. This reset issue is not a common problem; only one case has been found among approximately 200,000 products so far.
    4. When the mass production program of 200,000 products was used to reflash the problematic unit, the reset issue still persisted.
    5. An ABA swap test of the MCU was conducted, and the problem followed the MCU.
    6. If a problematic sample is needed for research and analysis, we can provide it附件2.docx
  • 0 in reply to cai cai
    TI__Genius 9775 points

    Hello, 

    Please reach out to your FAE/FQE. He or she will know the proper next steps for sending this unit through the quality return process. 

    Thanks,

    Isaac

  • 0 in reply to Isaac Larson
    Prodigy 30 points

    HI Isaac Larson,thanks for your reply,but we don't want to return the product; we just want to find out the reason.Can you open the attachment 2?we look forward to your reply,thank you! 

  • 0 in reply to cai cai
    TI__Genius 9775 points

    Hello, 

    To determine the reason, we would need to complete an investigation on the hardware. We would run the device through the test sequence, bench testing, and then tear down if needed for root cause analysis. 

    The issue seems to be within the MCU, so we would need to run through the quality return process to provide a conclusive answer. 

    We can take a deeper look if you choose to send the unit through the quality return process. 

    Thanks,
    Isaac