Other Parts Discussed in Thread: CC2640, TPS782
I'm doing a redesign of my cc2640 board following the suggestion of TI engineers and i need some help to know if i'm doing it well or is something wrong. The list of things i have to improve in my old desing was:
- Add antenna tuning components:
I added an extra inductor and now RF frontent is with external bias.
- All RF comp should have separate vias to GND.
I don't understant what that means. It means that the RF have to have separate ground planes?, or only vias? because the old design have separate vias or i'm missing something. Also in the Ti referecne desing i don't see separate gorund planes for RF components.
- There should be no routing between decoupling GND vias and the vias under the chip.
Now there is direct path from decoupling capacitor vias to the cc2640 ground vias.
- Routing under the crystal traces is not recommended
I change the path of VDDR and now there isn't any trace behind crystal signals.
- Distance from the RF pins to comp should be kept to a minimum.
I put the RF components the closest as posible to the cc2640
- Decoupling caps should be placed close to the pin it is to decouple.
I think in the old design have the decoupling capacitor close, but i tried to put them as close as posible too.
Can you check is the design is correct or if i need to change something before i send it to fab?
I undesrtant that with a image is dificutl to check the design. If you need more info i can make more images or send you the files.
Thanks.




