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I use a 4-layer board, on the top layer, there are 2530 and 2591, and I calculate the line width using the H which is the distance between the top layer and the second layer (GND layer) .
At the same time, I put a balun on the bottom layer. In the reference design of cc2530+2591, it seems that you calculate the line width using the H which is the distance between the bottom layer and the VDD layer (the 3rd layer) . If calculated using the H between the 2nd layer and the 4th layer, the line width should be much larger.
So the question is, why you choose the H of the distance between 3rd and 4th layer, but not the distance between 2nd and 4th layer? I think the H should be the distance between the layer which the Microstrip line is on and the GND layer.
Lookint forward to your answer.
Regards.
Steven Jin.
As long as you have capacitive coupling (or some other RF path) between the power and ground planes, then either plane can be considered "ground" for microstrip.
First of all, thank you for answering my question, Mr Barr.
But I was wondering what do you mean by "have capacitive coupling between the power and ground planes"? I don't have any RF path between the power and ground planes. I set the power and ground planes just like the 2530+2591 reference design.
I'm truly a green hand in this area, so I hope you can help me with patience. Thanks a lot~
Regards.
Steven Jin.
Hi Steven
If you consider decoupling capacitors as perfect RF short, power plane can be considered RF reference gnd. I have used this assumption in several designs without problem.
Tor-Inge