CC115L: Footprint

Babak Shadkanloo

Part Number: CC115L
Other Parts Discussed in Thread: CC1101

Hi,
Regarding the CC115L footprint, I have a question about the datasheet's PCB layout recommendations. It mentions tenting the vias on the component side of the PCB to prevent solder migration during the reflow process and advises against 100% solder paste coverage to avoid outgassing issues. However, when I checked the CAD/CAE Symbol section of the part page, the footprint includes nine vias instead of the five mentioned in the datasheet, and the vias are not tented. Which one is correct? Should the vias be tented, and should there be nine vias instead of five?

Thank you

11 months ago

0 ZC 11 months ago

TI__Genius 13890 points

Hi Babak,

This is a good question and is answered in more detail in the following thread (the CC115L and CC1101 reference designs are the same): https://e2e.ti.com/support/wireless-connectivity/other-wireless-group/other-wireless/f/other-wireless-technologies-forum/408257/cc1101-datasheet-discrepancy

In short, follow the datasheet layout recommendations: tented vias and the footprint given in the datasheet. These are what TI's reference designs use and have been extensively tested.

Regards,

Zack

Sub-1 GHz

Sub-1 GHz forum

CC115L: Footprint