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DRV8825 Junction-to-board thermal resistance

HM
Intellectual 460 points
Other Parts Discussed in Thread: DRV8825, DRV8818

On the datasheet of DRV8825,  Junction-to-board thermal resistance is specified as 5.6 degC/W.  On the other hand, DRV8818 which is same package (PWP 28pin) is specified as 14 degC/W.  Why each resistance are so different?

Best Regards,

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  • 0
    TI__Mastermind 26065 points
    Hi Hide

    If look at the last pages, the PowerPAD size of the the two devices are different. This is critical to the thermal spec. Also the die size and some other internal dimensions will affect the thermal data as well. I think it is not strange of the difference on Junction-to-board spec.

    Although they are simulatied data, personally I alway think the thermal model and calculation is very accurate :)

    Best regards,
  • 0 in reply to Wilson Zuo
    Intellectual 460 points

    Hi Wilson,

    I confirmed thermal pad side of the two devices are different.

    Thanks for your feedback.

    Best Regards,

    Hide