This thread has been locked.

If you have a related question, please click the "Ask a related question" button in the top right corner. The newly created question will be automatically linked to this question.

WL1835MOD: Potting of the WL1835MOD WiLink 8 Single-Band Combo Module

Part Number: WL1835MOD

Hi,

I have a question regarding the WL1835MOD WiLink 8 Single-Band Combo Module – WiFi, Bluetooth and Bluetooth Low Energy (LE). At the moment, we are considering using this part in one of our products. The product is intended to be Potted. I have been searching on the internet about RF Modules being Potted and came across a FAQ from Laird Connectivity and they say that if one of their RF Modules is applied with any compound, conforming coating or potting directly to the module, it will void the warranty. Then they go on to recommend encapsulating the module in free air-space and sealed with glue before potting the device.

 

Is this also the case with the WL1835MOD Module? What recommendations do you give about potting this module?

Best regards,

Matthew