Hi, everyone.
Our team is working for portable ultrasound medical system design. We have to design extremely small system that is why we use LM965xx chipset. I've read datasheets of LM96570, LM96551, LM96530 and some posts: №1) http://e2e.ti.com/support/other_analog/imaging_afes/f/239/t/226250.aspx
№2) http://e2e.ti.com/support/other_analog/imaging_afes/f/239/t/258444.aspx
Also I've seen an electrical scheme of the TX-SDK-V1:
№3) http://www.ti.com/lit/ml/snac053/snac053.zip
Nevertheless I have some doubts. So let me ask some questions.
Q1. Rohit suggested to use the combination of 0.1uF+10uF capacitors between the pins VPF --> VPP & VNF --> VNN of LM96551 (see link №2). He also highlighted that the voltage rating for the capacitors should be around 100V. I can't understand this voltage rating. According to datasheet the difference between this pins is 10V. In the scheme (see link №3) I can see CB6=>0.1uF(0402) + CB6X=>10uF/16V (0805) capacitors. So, can I use capacitors with voltage rating 16V or 25V?
Q2. In the scheme of the TX-SDK-V1 (see link №3) I can see 0.1uF capacitors CB10, CB9, CB10A, CB9A (for example). All of them are connected to the pins which are close to each other. So my question is, can I use one 0.47uF or two 0.22uF capacitors to minify an occupied area? If not, why is it better to use 4 separate capacitors?
Q3. Following Q2, can I make the same changes with the capacitors: CC8 - CC9 - CC10, CC1 - CC2 and so on?
Q4. I can't find the capacitors CB9A, CB10A, CB6X, CB4X on the top layer of the TX-SDK-V1 (see link №3 -> User Guide -> Figure13). Are them on the bottom side?
It would be great to minimise a size of our system, but in the case if we won't minimise the quality of this one.
Thank you for your answers!
Konstantin