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How do we know BGA is collapsing-or-noncollapsing-bga-balls ?

Toan Nguyen96
Prodigy 30 points

is LP3991TL-1.3/NOPB collapsing-or-noncollapsing-bga-balls? Thanks

  • 0
    TI__Mastermind 22610 points

    The difference is in how the solder pad area is defined on the pcb: by the solder mask opening; or by the copper pad surface.

    For larger pitch package (>0.60mm), we suggest to use 'non solder mask defined' pad (NSMD) where the solder mask opening is larger than solder pad. There will be a gap in-between to allow the solder joint wrap around the PCB pad. This is 'collapsing'.

    For fine pitch package (<=0.50mm), we suggest to use 'solder mask defined' pad (SMD) where the pad is larger than the solder mask opening so the solder ball would not wrap around the pad. This is 'non-collapsing'.