Iwould like to confirm the thermal simulation model.
The customer wants the thermal simulation (thermal hydraulics, heat flow) with TPS65000.
Do you have the thermal simulation model (like DELPHI model) for TPS65000?
If you don't have it, can you make it?
Best regards,
Atsushi Yamauchi
Yamuachi-san,
I checked with our team and we do not have a system thermal model for this device. Creating a system thermal model would introduce system parameters in which TI does not dictate and depends on how the customer uses TPS65000 (i.e. chassis or heat sink, amount of air flow, board type, etc...). What we do control is our thermal characteristics of our package (see excerpt from datasheet below). The customer could use these as parameters to generate their own system thermal models. To help aid the customer in generating other system parameters important for the thermal model, the customer can reference the application note below for specifics (see link below). Let me know if there are any questions. Thanks!
Link to application note:
http://www.ti.com/lit/an/spra953c/spra953c.pdf
Regards,
Paul Kundmueller
