The TPS65218 data sheet states that the thermal pad should be tied to PCB ground plane using a min of 25 vias. I also see the TPS65128 evm has 25 via configuration for thermal pad configuration.
But, the gerbers for ARM MPU AM438X ePOS EVM, only show 9 vias.
Question is, which is correct? I am assuming the 25 vias and if so, then why would the AM438X evm layout have 9?
