TPS22924C: Backside Coating

Hi Steve,

You are correct, the TPS22924CYZPT does NOT have backside coating and the TPS22924CYZPRB does.

Thanks,

Alek Kaknevicius

Thanks much.  We are seeing some cracking issues; how much more robust is the coated device?

Hi Steve,

While the backside coating does add an extra layer to the device, I would not expect it to fix any cracking issues in manufacturing.

Thanks,

Alek Kaknevicius

This question from customer:

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I would appreciate getting more information on the backside coating. Is there a compromise with using these parts over the non-coated parts? Are they layout compatible?

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Looks like the layout is the same, but any comentary you can add on what exactly the coating does to improve mechanical integrity?

If the parts are getting too much pressure during SMT I wouldn't expect a coating to help, but clearly it must help in some ways?

Hi Steve,

Recently, we had a TI packaging engineer post the following article online:

This may be a good resource for the customer to read and helps to explain how backside coating affects a CSP device. To answer your other question, yes, the layout would not change.

Thanks,

Alek Kaknevicius

Thanks for the update; the conlusions of this article are a little counter to the footnotes in the data sheet recommending new designs use back-coated devices.

Any other comments?