Other Parts Discussed in Thread: LDC1612
Hello Team,
Is it possible for FDC to achieve following measurement?
*Wafer flatness inspection
Distance from sensor to wafer 14mm or 25mm
Resolution 0.1mm
Sampling rate 150sps
Best regards,
Tetsuro
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Hi Tetsuro,
This won't be easily achievable. The target distance is up to 25mm with 0.1mm resolution, which would require a larger sensor. In order to get an idea of the surface flatness, the sensor would need to move, scan the surface, and look for any deviations. Additionally, the sensor also need to distinguish tilt from flatness or other surface effects of the wafer. It may be possible, but you would need a lot of evaluation to prove out.
Best,
Jiashow