Dear,
in the datasheets for LM26LV, LM57 there is stated that "best thermal conductivity between the device and the PCB is achieved by soldering the DAP of the package to the thermal pad on the PCB. The thermal pad can be a floating node".
What is the voltage limit on that DAP-pad? Is the die insulated by oxide or by junction? I intend to connect it to drain of PMOS, operated from 35V, no fast switching expected (no issues with noise immunity).
Thanks in advance for support!