Tool/software:
HI TI experts,
We are currently carrying out a thermal evaluation of the system,
can we receive information on the heat sources and internal temperature sensors ?
Note: Application Note Thermal Management of TDA4x and AM6x
HI Board designers,
Refer below internal temperature sensors location:
AM64x/AM243x (ALV, ALX) the numbering is:
Temp Sensor 0: A53
Temp Sensor 1: DDR controller
AM62x the numbering is:
Temp Sensor 0: DDR controller
Temp Sensor 1: A53
In AM62A, the numbering is:
Temp Sensor 0: c7x
Temp Sensor 1: A53
Temp Sensor 2: DDR controller
In AM62D, the numbering is:
Temp Sensor 0: c7x
Temp Sensor 1: A53
Temp Sensor 2: DDR controller
In AM62P, the numbering is:
Temp Sensor 0: GPU
Temp Sensor 1: A53
Temp Sensor 2: DDR controller
AM62L Voltage and Thermal Manager Location:
There is 1 Voltage and Thermal Monitor located on AM62L.
Temp Sensor 0: DDR/A53
Guaranteed accuracy of internal temperature sensor
+/- 5 deg C is the guaranteed temperature.
Temperature range for the specified accuracy
Applicable family of devices: I assume this would be valid for all the AM62x and AM64x devices. Any thoughts
Yes, this is same and applies to all AM6x devices
Any plans to update the collaterals
The VTM accuracy specs will be updated in the next revision of the data sheet.
The next TRM version will include the sensor location information.
Additional references:
Thermal Management of TDA4x and AM6x
Regards,
Sreenivasa
HI Board designers,
Refer below
In order to measure the SOC temperature, you can follow the steps mentioned below:
(Adding an example below for better understanding)
Example
1.
2. 8095F = 00000000000010000000100101100001 -> 0101100001 = 353 (Taking 10 least significant bits)
3. 
a.
a. Substitute x=353 in the equation above and calc. the SOC temperature.
b.(-9.2627E-12)x(353)4 +(6.0373E-08)x(353)3 +(-1.7058E-04)x(353)2 +(3.2512E-01)x(353) +(-4.9002E+01) = 47.02384904775517°C
Regards,
Sreenivasa
HI Board designers,
Inputs related to SOC temperature
Its important to note that the Linux SDK is designed to enable functionality of the TI EVMs rather than being optimized for power or temperature. Because of this, running the default SDK will tend to increase the loading of the application cores and DDR which leads to higher temperatures.
Before continuing, please note that improving thermal performance can be at a cost of performance of the SoC.
Some general optimization suggestions to improve thermal:
You will need to download and install the Linux SDK for AM62P which can be found here: https://www.ti.com/tool/PROCESSOR-SDK-AM62P
For getting started with the Linux SDK, refer to the Linux SDK Documentation: https://software-dl.ti.com/processor-sdk-linux/esd/AM62PX/10_00_07_04/exports/docs/devices/AM62PX/linux/Overview.html
For more information about the Device Tree, refer to the Linux SDK Documentation Guide on Building the Linux Kernel Components: https://software-dl.ti.com/processor-sdk-linux/esd/AM62PX/10_00_07_04/exports/docs/linux/Foundational_Components_Kernel_Users_Guide.html#compiling-the-device-tree-binaries
For additional resources getting started, refer to the AM62P Academy page: https://dev.ti.com/tirex/explore/node?devtools=SK-AM62P-LP&node=A__AEIJm0rwIeU.2P1OBWwlaA__AM62P-ACADEMY__fp5YxRM__LATEST
I am applying over 180C since I am evaluating it for high temperature operation. The target application needs high temperature upto 190C operation
The answer is no. The datasheet ROC table clearly defines the two valid operating temperature ranges supported by this device.
The problem was i didn't set the system separators correctly. Once i set “.” for decimal and “,” for thousands, the results changed for different temperatures.
Regards,
Sreenivasa
