Part Number: LMR36506-Q1 Tool/software: Hello TI HQ Team,
Please provide the information about the Leakage Current (Zero Gate Voltage Drain Current) passing through the internal transistor in the PGOOD circuit in 3 different temperatures ranges -40 degC…
Part Number: LMR36506-Q1 Tool/software: Looking for some assistance here. Wanted to use this little switching regulator: lmr36506RS3QRPERQ1
Power in is 12V(~11.8 after schotky). I have verified that 11.8V is seen at both VIN (p4) and EN/UVLO(p3). They…
Part Number: LMR36506-Q1 Tool/software: VQFN-HR packages such as the LMR36506MSCQRPERQ1 use a Flip Chip (Solder Bump-Cu Pillar) structure. Since when has this technology been mass-produced by TI? What is the total production volume achieved so far?
Part Number: LMR36506-Q1 Tool/software: Hi,
I use LMR36506-Q1 as Vbus (5V) generation for USB2.0 OTG application
VIN =12V
Vout=5V
;;;; Vout connect to USB connector Vbus
when we plug the USB to the computer which is host, we noticed that VIN = Vout when…
Part Number: LMR36506-Q1 Tool/software: Hello,
I am currently making a design for 24V automotive applications. I have a single MCU and transceiver (LIN or CAN) with current consumption like 60-70mA @ 5V.
Since my design is for 24V systems, I can not…
Part Number: LMR36506-Q1
Tool/software:
Hi, Support Team
our client test V_PHASE of Jitter is fail, If i change C136 c apacitance value 33pf to100pf?
could workable?
test waveform:
if any suggestion, Please advise me.
Thanks,
Best regards,
Lawrence
…
Part Number: LMR36506-Q1 Tool/software: Hello team,
Customer is going to use LMR36506-Q1, but there is not a corresponding GPN for FSW=400k, Vout=5V work condition, pls check below screenshot, so which one should be used for the case?
Thanks!
Part Number: LMR36506-Q1 Tool/software: I would like to know the the purpose of RINJ in LMR36506MSCEVM since it is not mentioned in the LMR36506-Q1 datasheet and how its values was calculated.
Part Number: LMR36506-Q1 Hi all,
I would like to know the internal structure of Flip-chip IC.
I think there is a difference with wire bonding IC as shown in the following image.
Benefits of flip chip on leadframe packaging for motor-drive applicatio…
