Part Number: LP5912 Other Parts Discussed in Thread: TPS745-Q1 Hi ,
We got OBS information about LP5912Q2.5DRVRQ1 :
"As much as I would like to provide the information, my hands are tied on this matter. Unfortunately, we do not have any information for…
Part Number: LP5912-Q1 Hi Experts,
Datasheet suggests that the pull-up resistor at PG pin should be 10-100kohm, can customer use 2.15kohm here? Because the PG pin is connected to the PORST pin of MCU, which has an internal 15kohm pull-down resistor. If…
Part Number: LP5912 Other Parts Discussed in Thread: ADS114S08 , TPS7A47
Hello,
I am designing an instrumentation system based on ADS114s08 and I need some help to decide which LDO could serve me better, in terms of cost and quality.
I found that TPS7A4700…
Part Number: LP5912-Q1 Other Parts Discussed in Thread: TPS745-Q1 Hi Sir,
The bonding wire material of LP5912-Q1 is PCC wire (based metal is Copper but with Gold and Palladium coating).
My customer is asking that if the bonding wire is Copper, there is…
Part Number: LP5912 Hi Sir,
We use LP5912-Q1 EVM and change the chip to LP5912-1.5 sample, below is our test results.
LDO
Vin
Loading rise
75mA
150mA
300mA
250mA_400mA
LP5912-1.5
1.8V
0.5us
0.33V
0.43V
0.485V
0.09V
Do…
Part Number: LP5912-Q1 Hello Sir/Ms.
The datasheet has a description of the following paragraph.
VIN = VOUT(NOM) + 0.5 V or 1.6 V, whichever is greater; VEN = 1.3 V, CIN = 1 μF, COUT = 1 μF, IOUT = 1 mA (unless otherwise
stated).(1) (2) (3)
What…
Part Number: LP5912-Q1 Hi all
Our customer have a question is below. They think that θJa usually has higher thermal resistance than θJc. But the LP5912-Q1 is θJc higher thermal resistance than θJa. Is it because there is a includes…