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Part Number: ONET2804T Hi team
Could you help check the PCB layout and Bonding Diagram? If any potential question remain, could you help identify?
I attached the bonding diagram in attachment files. And I attached the PCB layout below:
RF side:
DC side…
Part Number: ONET2804T dear:
one of our customer need used ONET2804T on 100G Rosa, have to questions :
1. for the filter capacitor:
in the datasheet, It is recommended to use two single layer ceramic (SLC) capacitors in the range of 270 pF to 68…
Part Number: ONET2804T My customer used our TI-TIA ONET2804T in their ROSA, when they test RSSI, they got split in different voltage input, please check the plot:
It was tested in Rrssi at 10kohm: (marked red in the second figure), his questions are: …
Part Number: ONET2804T The datasheet for the ONET2804T recommends 2 single layer caps between 270pF and 680pF to be bonded to the VCCI pads. If the ONET2804T will be mounted direct to the laminate and not to a ceramic substrate, can the VCCI connections…
Part Number: ONET2804T I am attempting to get the full datasheet for the ONET2804T TIA. The email address "onet2804t_request@ti.com" bounces back as undeliverable. How can I see the full datasheet and any reference design files? Thanks.
Part Number: ONET2804T I would like to order one of these parts in die form, but I need to know the pad pitch and pad layout (signal location on the die) on the die so I can design my test board for optimal wirebonding. Can anyone provide me that information…
Part Number: ONET2804T Hi,
I sent a request email about ONET2804T full datasheet to 'onet2804t_request@ti.com' (in ONET2804T brief Datasheet)
but I got the message that this email could not be delivered.
How can I get the ONET2804T full datasheet…
Other Parts Discussed in Thread: ONET2804T , ONET8551T Is the ONET2804T device suitable for use with either APD or PIN photodiodes (similar to the ONET8551T) or is it recommended for PIN photodiodes only?
Is there anything different in the design of devices…
Part Number: ONET8551T Other Parts Discussed in Thread: ONET2804T I have multiple questions to help us develop our process to assemble the bare die boards:
What is the bond material?
What is the passivation material?
Are there suggested bonding parameters…
