Hello Shifali,
For reflow/solder profile max temperature of the THS4531ID, this information can be found in the Ordering and Quality tab of the product folder.
The device has a MSL rating/Peak reflow of Level-2-260C-1 Year, meaning 260C is the max reflow temperature of the THS4531ID.
For guideline documents on reflow profile for our packaging:
SMT & Packing Application Notes
1) Handling and Process Recommendations
a) MSL Level 2 (1 year) for THS4531ID
2) Absolute Maximum Ratings for Soldering
a) 260C
3) Wave Solder Exposure of SMT Packages
a) Solder Dip vs Wave Solder vs Reflow
4) MSL Ratings and Reflow Profiles
a) MSL Level 2 (1 year)
b) Reflow Oven Zone vs Temp J-STD-020 Classification Profile
5) Mounting of Source Mount Components
a) Changing Assembly Techniques and Technologies
6) Forward/Backward Compatibility
a) Reflow Profile, Lead-Free Process
Thank you,
Sima
