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OPA549: Lead forming for converting OPA549S to OPA549T

Kazuki Kuramochi
Genius 9685 points
Part Number: OPA549

Hello Expert,

My customer has question for OPA549.
They are planning to use OPA549T for their products but they are facing supply issue with this.
Then, they plan to use OPA549S as OPA549T because they has equipment to do lead forming.

However, For this procedure, they'd like to get advice from TI.
They can do lead forming but they don't have enough knowledge about how to check whether there is damage on bended device.
Would you provide advice for confirming damage when they do lead forming for converting OPA549S to OPA549T?


Best regards,
Kazuki Kuramochi

  • +1
    TI__Guru* 93105 points

    Kuramochi-san,

    The OPA549 lead forming is accomplished overseas at an assembly facility so we don't have the ability to observe the process firsthand at this location. Nonetheless, we do see what the finished OPA549 product looks like when we have received devices. Therefore, about all I can provide are some general comments.

    First and foremost make sure that the OPA549 leads are formed to conform with the KV ( R-PZFM-T11) mechanical data sheet for the plastic flange-mount package included near the end of the datasheet. The drawing shows the lead bend points, but unfortunately no information about the bend radius dimensions. The bend radiuses shown in the mechanical drawing do look similar to what is obtained with the actual device so the goal should be to achieve similarity between them.

    A clean bend should not show any stresses or disturbances of the lead surface plating. If the bends are too severe that may happen and could be an undesirable result. 

    Regards, Thomas

    Precision Amplifiers Applications Engineering

  • 0 in reply to Thomas Kuehl
    TI__Genius 9685 points

    Thomas-san,

    Thank you for your kindly explanation.

    I understand and will let you know when I have further question.


    Best regards,
    Kazuki Kuramochi