LMV7219: Please provide the Reflow Profile for LMV7219M5/NOPB

Hello Anusha,

TI follows the IPC/JEDEC-020 standard soldering profile.

Please see the following appnotes:

MSL Ratings and Reflow Profiles (Rev. A)

Recommended Soldering Profiles (Rev. J)

The LMV7219 web page shows "Level-1-260C-UNLIM", which means Level 1 moisture sensitivity, 260°C peak reflow and unlimited floor storage time.

Hi Paul ,
Please elaborate floor storage time.

Thanks Paul,
I wanted to know about the maximum reflow temperature(TP)

From the link you shared for MSL Ratings and Reflow Profiles (Rev. A), i found this graph which says 30seconds maximum.
Is data is applicable for all the TI components having package SOT23-5, SC70-5, VLGA-13, MSOP-8, VSSOP-10, WQFN-28 ?
Or this data will varies from part to part.?

Hello Anusha,

TI tests all packages to the JEDEC-020 reflow profile. There may be differences in the peak temperature (tp) per device, which is shown in the product folder ordering table and in the ordering table on the datasheet.

Hi Paul,
So the time of maximum reflow temperature(Tp) = 30seconds for all the packages?