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OPA2210: Thermal pad connection

Suzzi maurizio
Prodigy 35 points
Part Number: OPA2210

The datasheet state that for the WSON package the thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.

But I can't find where the thermal pad should be connected.

I guess connecting the pad to V- whould be the correct solution.

  • 0
    TI__Genius 13325 points

    Hello Suzzi,

    Yes your suggestion is correct; the thermal pad should be connected to V- (negative supply).  I verified there is conductive die attach from the thermal pad to the bottom of the die, which means the substrate will be electrically connected to the thermal pad, and therefore needs to be biased to V-.

    We will forward this to the team so it can be added to the data sheet in the next revision.

    Best Regards,
    Mike