Hi Team
My customer needs to learn if OPA607IDBVR is CUPstructure (referring to active circuitry on the die underneath the bond pads) to recognize the material, could you kindly provide the information?
Regards,
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Hi Team
My customer needs to learn if OPA607IDBVR is CUPstructure (referring to active circuitry on the die underneath the bond pads) to recognize the material, could you kindly provide the information?
Regards,
Hello Charles,
I will ask the design team, and will let you know as soon as I receive a response.
Thank you,
Sima
Hello Charles,
I received a response from the design engineer:
"There is no active circuit other than the ESD steering diodes underneath the pads in OPA607. These are reverse biased diodes activated only during the ESD event."
Thank you,
Sima