I am currently working a PCB layout using the ISO224BDWVR isolation amplifiers. I am looking at the recommended layout example on the datasheet (section 11.2) particularly the clearance area that is to be kept free of any conductive materials; looking for more info on the rationale for this clearance area, as I would like to consider placing a second ISO224 part on the opposite side of the board as the first ISO224 part, where both parts use the same clearance area. Board thickness would be ~3mm. Curious if this clearance area is for sake of isolation integrity or more for RE concerns out of the part and if "stacking" two parts could potentially cause interference amongst each other.