OPA140A-DIE: Maximum DIE temperature in fabrication process

ArTzy

Part Number: OPA140A-DIE
Other Parts Discussed in Thread: OPA140

Hi Experts,

God day.

Could you support this query from client about maximum die temperature:

They are planning to use the OPA140ATDD2 device on a ceramic PCB. They are sealing the circuitry in a ceramic and Kovar chamber with a lid. The temperature will go up to 350 degrees Celsius. Can the OPA140 DIE handle this temperature for a 5 minutes period while the lid is being sealed?

Thank you.

Regards,
Archie A.

over 3 years ago

0 kai klaas69 over 3 years ago

Guru 140200 points

Hi Archie,

5 minutes?

Kai

0 Raymond Zhang1 over 3 years ago

TI__Guru 66631 points

Hi Archie,

Can the OPA140 DIE handle this temperature for a 5 minutes period while the lid is being sealed?

Based on the reflow oven temperature profile, my guess is that the IC may not be able to handle up to 350C for longer duration (without degradation). The issues are the exposed peak temperature at 350C and duration. The customer may have to experiment it somewhat. I do not have references or data to support the sealing process (may have to ask our packaging experts).

Also, please consider the sealing atmosphere environment. Air is not a good option. N2 or inert atmosphere may be more applicable to protect the die and metalized thin films. I will ask our packaging experts and provide you with a suggestion.