Hi Genrikh,

can you provide the part's status and availability?

I see that the part is available in TI store, please check the link below. 

https://www.ti.com/product/OPA2140#order-quality

If you have additional questions, please let us know. 

Best,

Raymond

Raymond,

1) As it is seen from the earlier chat here, I was told the part was supposed to be released in November 2021. Is it correct to say the part has not been released as of today? 

2) I want to replace the other vendor's part in my design with this one. I cannot put the unreleased part in my design. Should I wait for release? For how long?

3) If and when part is released, I need 100 pieces in June and more later this year. Should I place multiple orders of 50 per order now, or wait for release? 

I am not seeing the statement the part has been released. This is also not seen at ti.com. Is there updated data sheet where the part is shown as released?

Genrikh,

Even though OPA2140: DRG (8-Pin SON) package shows on the website as preview, it is clearly released since it is available for purchase - just the OPA2140 datasheet has not been updated to reflect this fact.  Thus, please place the order now because currently there is only 90 units left in TI inventory - see below.

Genrikh, I stand corrected.  I just talked to the marketing team and was told that OPA2140AIDRGR is actually under what is known as APL status (Advanced Product Launch).  However, the only difference between APL and RTM is that the units come from pre-production, which means they were tested by our engineering team instead of manufacturing folks.  Having said that, there should be no difference whatsoever in the parts' performance.  As far as the latest RTM date goes, OPA2140AIDRGR is currently scheduled to be release at the end of May'22.

No problem. As you may see OPA2140AIDRGR is the only package still available, Thus, I would get those part before they disappear.

I have to re-open this case. I am not finding information on the exposed thermal pad dimensions. It is not available in the existing data sheet. It is also not available in the package information sheet mpds151b.pdf at ti.com. Can this info be provided? 

I believe the DRG (SON-8) thermal pad dimension is 1.2mm x 2.0mm - see below.

yes, I saw the note. The data sheet does not provide dimensions though. I guessed them by going and finding other parts in the 3x3mm WSON package. I Should I believe in package dimensions consistency among the parts with similar outer dimensions?

Since the thermal pad must be soldered to the board, its exact dimension should not be critical. Having said that, its dimension could very within +/-0.1mm.

This is not what I asked. As I have the PCB fab designed for use with WSON part of another manufacturer, I need to make sure this replacement part fits the existing part footprint, including solder mask and stensil dimensions.

Hi Genrikh,

Below is TI's WSON available packages. WSON in DRG is used for 8-pin op amp type. As you may know, WSON is not widely used package in op amps. I do not know other manufacturers' 3mmx3mm WSON-8 pin are defined in op amps.   

https://www.ti.com/packaging/docs/searchtipackages.tsp?packageName=SON

If you have other questions, please let us know. 

Best,

Raymond

1) There sure is at least one other manufacturer; 2) I am not able to pay online for the order. Teh only allowed option to pay for S&H is my company's Fedex or DHL account . The DHL account I provide is not being accepted by TI Store. What is the resolution of this this issue?

Hi Genrikh,

I am unable to assist you when dealing with orders via TI Store. Please contact TI Store via customer service. To be honest, I have not contacted the assistance personally.  

https://education.ti.com/en/forms/global_forms_customersvcform

https://www.ti.com/product/OPA2140#order-quality

https://www.ti.com/ordering-resources/help/creating-managing-your-ti-store-account.html?keyMatch=TI%20STORE

If you have other questions, please let us know. 

Best,

Raymond

Raymond/Marek,

This is what I was worried about. Please check the dimensions of the thermal pad in OPA2211AIDRG (pp.47-48 in the data sheet). It is also WSON-8 3mmx3mm package. So, trusting the table in the packaging information is dangerous. As long as the thermal pad dimensions in OPA2140AIDRGx data sheet are not provided, what info DE should rely on? Can correct and reliable info be provided?

What is part's release date? 

BTW, these are some op-amp manufacturers using WSON package (though mfg names may be different): ADI, Diodes, Microchip, Rohm, Renesas, STMicro.

Thank you,

Genrikh

Hi Genrikh,

I will confirm OPA2140AIDRGx's thermal pad dimension with a different team in TI tomorrow.  

I am fairly sure that Marek's calculation is correct. If you take the known scale in the drawing and ratio it against unmarked dimensions (say with a caliper), the ground lug dimension will be found to be 1.2mm x 2.0mm, ±0.1mm in tolerance. 

What similar WSON op amp package have you found in other manufacturers, such as ADI, Microchip, ST or others? Can you present an image or two as examples?  

Best,

Raymond 

Hi Genrikh,

I checked with the WSON (DRG or S-PWSON-N8) package used in our products. The specific WSON package are found in numerous products, see the link below. The specific WSON package is one of our standard. 

The image below is shown in mouser.com in OPA1612AIDRGR, which is identical to OPA2140AIDRGR's package. 

https://www.ti.com/packaging/docs/searchproductbypackage.tsp?orderablePartNumber=&packageDesignator=DRG&pinCount=8&results=results#resultspage

Regarding to OPA2140AIDRGR parts, I did not find the equivalent one in WSON package in ADI. I will not be surprised that some manufactures have a slightly different ground lug dimensions from ours. Can you show us the equivalent performance of OPA2140AIDRGR op amps from the manufacturers that you are talking about? 

Best,

Raymond

Hi Genrikh,

It turns out that the APL OPA2140 datasheet pages were added manually and an inaccurate info slipped in.  I have checked the OPA2140AIDRGR package thermal pad dimensions with our System Engineering team and confirmed it actually is the same as in the case of OPA2211 - 1.45mm by 2.4mm as shown below. Sorry for all the confusion.

Marek,

Thanks for the correction. I was able to measure the sample at the microscope with measuring capabilities and obtained same results. So al is good now.

Is release date for this part known? I am confident it can work in my circuit but cannot design in unreleased components.

Thank you,

Genrikh