Hi
We have been having some soldering problems with the LMH6554 on our boards - we have noticed that the paste layer provided by TI online (via ultralibrarian https://vendor.ultralibrarian.com/TI/embedded/?gpn=LMH6554&package=NHJ&pin=14&sid=litd9f1f400d9f1f400d9f1f4006091e27d88ef0cb&c=1) does not seem to match the datasheet. In particular, the solder paste layer is offset from the pads, and larger than the recommended 0.6x0.2mm land pattern. Is this intentional, or is this an error in the provided footprint?
Thanks
Jordan