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THS3001-DIE: Temperature Range

Edward Woertz
Prodigy 10 points
Part Number: THS3001-DIE
Other Parts Discussed in Thread: THS3001

I am interested in using the THS3001-DIE in an application requiring -45C to 85C temp range. The die datasheet does not have technical performance so I am using the packaged version datasheet. The packaged version of this part is available in 2 classes: commercial (0C to 70C) and industrial (-45C to 85C). Are these different devices or just screened differently? Which aspects of the packaged part datasheet can I assume are applicable to THS3001-DIE?

  • 0
    TI__Mastermind 23809 points

    Hello Edward,

    Thank you for the good questions; I will check on this and get back with the exact temperature range for the THS3001-DIE.

    Best,

    Alec

  • 0 in reply to Alec Saebeler
    TI__Mastermind 23809 points

    Hello Edward,

    After consulting with various team members, our conclusion is as follows:

    DIE devices are tested and rated for a usage temperature according to Mean Time Between Failure (MTBF) and Failure in Time (FIT) estimates.  This is typically room temperature, for the THS3001-DIE, 55°C is specified.  Unlike packaged devices, DIE parts are not specified across a temperature range.  DIE customers will package and assemble dies to their own designs, and the choice of package or assembly will effect the temperature range over which the die can perform in specification.  

    Given the various handling and interceding design choices elected by a die customer, TI does not specify or guarantee performance to the same level seen in packaged devices.  The extended temperature range of the industrial THS3001 packaged IC may apply to the capabilities of the THS3001 die, but this probable behavior is not a guarantee.  

    Viewing the THS3001-DIE datasheet, a sub-note on the first page states, among other things: "Unless otherwise specified by Texas Instruments AC performance and performance over temperature is not warranted."

    In summary, the THS3001-DIE performance, including over temperature, could adhere to the packaged THS3001's performance in the same conditions.  While probable, this is not guaranteed or specified to the purchaser of the THS3001-DIE unit.  To answer your question, no aspects of the THS3001 packaged IC are applicable in the sense of guaranteed/specified performance, but the probable outcome is for the devices to behave similarly over temperature and otherwise.  The association of the DIE part to the packaged part is true (and the basis for why someone would purchase a die part), but the nature of selling wafer die prohibits any guarantee or specification of die performance.  The THS3001-DIE is a die-only variant of the THS3001 in commercial or industrial packages.

    Best,

    Alec