TLV7022: Floating power pad on TLV7022

Christina Lim

Part Number: TLV7022

Hi,

My customer is planning a use case at low current implementation for communication module using TLV7022. May I know if there is any adverse impact if the TLV7022 central thermal pad is floating (no PCB solder footprint) without connecting any on PCB?

Thanks,

Christina

over 2 years ago

0 Clemens Ladisch over 2 years ago

Guru 276380 points

If thermals are no problem and if you do not care about mechanical integrity, then you do not need to solder the pad. See [FAQ] Where do I connect the thermal pad of the logic QFN devices?

0 Paul Grohe over 2 years ago

TI__Guru 53306 points

Hello Christina,

They can float it, but we still do recommend tying it to Vee (pin 4) to prevent noise injection..

Do note that the thermal pad does add physical strength for mounting. If a thermal PCB pad is not supplied, then the package will only be held on by the tiny lead pads and possibly may not solder correctly (the thermal pad helps "center" the package when soldering).

They should discuss this with their PCB assembly experts. This may lead to assembly issues.

TI recommends the thermal pad, as well as tying it directly to pin 4.

Amplifiers

Amplifiers forum

TLV7022: Floating power pad on TLV7022