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LMP7704-SP: Thermal Pad

Ray Vincent Aranzaso
Mastermind 18180 points

Part Number: LMP7704-SP
Other Parts Discussed in Thread: LMP7704

Hi,

Good Day. Customer wants to verify if LMP7704-SP has a thermal pad on the back side of the HBH package. Not called out on the data sheet, but redlined on the separate HBH package sheet. Please advise as the catalog version of this device has no thermal pad included on the device. Thank you very much.

Best Regards,

Ray Vincent

  • 0
    TI__Expert 4720 points

    Hello Ray,

    It is called out on the second to last page of the datasheet, in the package details section. The catalog version comes in different packages and not an HBH package. What can be seen in the 6.4 Thermal Information section of the LMP7704-SP is the junction to case(bottom) thermal resistance which is not seen in the regular LMP7704 version. Which gives a clue to there being a thermal pad on the bottom of the case. The expert on this part is not available at the moment I will have him verify my comments by the end of the week.

    Regards,

    Castrense

  • 0 in reply to Castrense Nigrelli
    TI__Guru* 93105 points

    Hi Ray,

    Castrense is correct, the LMP7704-SP does have a bottom side thermal pad. The datasheet drawing on Pg. 26 shows it, but doesn't label it. If you access the package information from the LMP7704-SP webpage it provides a more complete drawing that labels the thermal pad:

    https://www.ti.com/lit/ml/mccf004a/mccf004a.pdf

    Regards, Thomas

    Precision Amplifiers Applications Engineering