OPA2277: OPA2277U

Hi Ruby,

this docmunent says that the IC packages can withstand three reflow cycles:

6622.spraby1a.pdf

Keep in mind that soldering counts to the most stressful events in the life of a chip. So, the number of reflow cycles should be limited to the absolute minimum. This is especially true for a high reliability application.

The internals of chip are sealed by the epoxy package material where the pins come out of the package. Soldering stress can result in a delamination at this point and the die will no longer be fully sealed against moisture afterwards which can result in internal corrosion and premature failure. But long before this destruction the die becomes sensitive to moisture and some of the electrcial specifications may no longer be valid.

Kai

Hi Ruby,

The document that Kai references is TI's official statement on the reflow subject.

Unofficially we have taken some Precision Amplifiers devices out to 5 cycles and the product remained robust. That was an unofficial experiment and we neither provide the data, or make any assurance beyond the 3 cycles referenced in the SPRABY1A Applications Note. All risk is assumed by the customer for application of more than 3 cycles.

Regards, Thomas

Precision Amplifiers Applications Engineering

Thank you!