This thread has been locked.

If you have a related question, please click the "Ask a related question" button in the top right corner. The newly created question will be automatically linked to this question.

THS4131: Device getting hot

Part Number: THS4131

Hi Team,

Can you help diagnose the customer issue below?

A customer is testing the device using the schematic from the datasheet (see below). 

In this test, the customer grounded both inputs instead of having a source voltage (a 10V DC source was connected in a different test which resulted in a package temperature of 113C), A 10k value is used for all the resistors, and Vocm pin was connected via a  0.1uF capacitor to ground. the value of Vcc+ was +15V and Vcc- was -15V. The result of this test was a package temperature of 85C which seemed high considering the device is in an idle state.

Could confirm whether this behavior is as expected?

Thank you.



  • The two pieces you need to answer this question are the internal power dissipation and the thermal impedance for the mounting used. Answer those, and you will make a lot of progress. 

  • Hi Marvin,

    the OPAmp has to dissipate 30V x 14mA = 0.42W. Times 126°C/W junction-to-ambient thermal resistance for the SOIC package gives a die temperature of 78°C at 25°C ambient temperature.

    Have you thought about using the DGN package with the power pad?